3-(Diethoxy(Methyl)Silyl)Propyl Methacrylate 甲基丙烯酰氧基丙基甲基二乙氧基硅烷

CAS 65100-04-1 MFCD00053879

化学结构图

65100-04-1
SMILES: CC(=C)C(=O)OCCC[Si](C)(OCC)OCC

化学属性

Mol. FormulaC12H24O4Si
Mol. Weight260.41
Density0.965 g/mL at 20 °C(lit.)
Refractive index1.4310 to 1.4350

别名和识别编码

Chemical Name3-(Diethoxy(Methyl)Silyl)Propyl Methacrylate
Synonym 3-(甲基二乙氧基甲硅烷基)丙基甲基丙烯酸酯 3-甲基丙烯酰氧基丙基)甲基二乙氧基硅烷
MDL NumberMFCD00053879
PubChem Substance ID253662135
CAS Number65100-04-1
EC Number242-185-2
Chemical Name Translation甲基丙烯酰氧基丙基甲基二乙氧基硅烷
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分类

  • Materials Science, Micro/NanoElectronics, Self Assembly & Contact Printing, Self-Assembly Materials, Silanes, Silicon, Solution Deposition Precursors
  • {SA} Materials Science, Micro/NanoElectronics, Self Assembly & Contact Printing, Self-Assembly Materials, Silanes, Silicon, Solution Deposition Precursors

安全信息

Hazard Codes C
WGK Germany3
Signal word
GHS Symbol
Hazard statements
  • H315 Causes skin irritation 会刺激皮肤
Precautionary statements
  • P264 Wash hands thoroughly after handling. 处理后要彻底洗净双手。
  • P280 Wear protective gloves/protective clothing/eye protection/face protection. 戴防护手套/防护服/眼睛的保护物/面部保护物。
  • P302+P352+P332+P313+P362+P364
  • P305+P351+P338+P337+P313

系列性分类

  1. Materials Science 材料科学
  2. Micro/NanoElectronics - Materials Science
  3. Self Assembly & Contact Printing - Micro/NanoElectronics
  4. Self-Assembly Materials - Self Assembly & Contact Printing
  5. Silanes - Self-Assembly Materials

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