Copper, bis[1,1,2,2-tetrafluoro-6,6-dimethyl-1-(trifluoromethoxy)-3,5-heptanedionato 双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II)

CAS 80289-21-0 MFCD00156516

化学结构图

80289-21-0
SMILES:

化学属性

Mol. FormulaCu(C10H10F7O2)2
Mol. Weight654
Melting Point59-61 °C(lit.)
Danger-Level
pH:
Redox

别名和识别编码

Chemical NameCopper, bis[1,1,2,2-tetrafluoro-6,6-dimethyl-1-(trifluoromethoxy)-3,5-heptanedionato
Synonym Cu(FOD)2 (6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II) 双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜 (6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II) Cu(FOD)2
MDL NumberMFCD00156516
PubChem Substance ID24878556
CAS Number80289-21-0
Chemical Name Translation双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II)
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分类

  • {SA} CVD and ALD Precursors by Metal, Copper, Materials Science, Micro/NanoElectronics, Vapor Deposition Precursors
  • {SNA} CVD and ALD Precursors by Metal, Copper, Micro/NanoElectronics, Vapor Deposition Precursors, 材料科学
  • {SNA} CVD and ALD Precursors by Metal, Copper, Materials Science, Micro/NanoElectronics, Vapor Deposition Precursors

相关文献及参考

安全信息

WGK Germany3
Personal Protective Equipment Eyeshields, Gloves, type N95 (US), type P1 (EN143) respirator filter
Restrict

系列性分类

  1. Materials Science 材料科学
  2. Micro/NanoElectronics - Materials Science
  3. Vapor Deposition Precursors - Micro/NanoElectronics
  4. CVD and ALD Precursors by Metal - Vapor Deposition Precursors
  5. Copper - CVD and ALD Precursors by Metal
  1. CVD & ALD Precursors

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